Dream Photonics Inc.

Producing scalable ultra-low loss optical interconnects for AI data-centers.

Mission

Our mission is to solve the optical packaging bottleneck, enabling mass manufacturable photonic modules.

Value Proposition

Dream Photonics accelerates the commercialization of AI, quantum, and next-generation communication hardware by solving the critical challenge of optical chip-to-chip and fiber-to-chip coupling. By utilizing advanced two-photon lithography for facet attached microlenses and providing a robust library of IP they enable seamless, low-loss, and high-yield hybrid integration of lasers, fibers, and optical components with photonic chips. Their alignment-tolerant, high-throughput packaging solution drastically reduces the costs and technical risks of traditional integration, smoothly scaling customer designs from prototyping to high-volume manufacturing.

WHY Dream Photonics Inc. STANDS OUT

01

The Bottleneck (The Problem): AI, quantum, and next-generation communication hardware are scaling at lightning speed, but getting light in and out of semiconductor chips remains one of the costliest, most complex manufacturing bottlenecks in the industry.

02

The Direct-Print Solution (The Value Proposition): Dream Photonics eliminates this roadblock using advanced 3D nano-lithography to print custom, alignment-tolerant micro-optics directly onto chips. Paired with our robust, hardware-verified Photonics IP library, we enable low-loss, high-yield optical coupling that scales seamlessly from prototyping to high-volume manufacturing.

03

The Momentum (The Proof & Call to Action): As an engineering spin-out out of UBC, we recently secured over $1.1 million in expansion funding to build out our domestic pilot manufacturing line. We have engaged with over 35 customers over the last 5 years actively helping hardware innovators address the integration bottleneck.